Our Products

Semiconductor Equipment

Enabling the next generation technology node.


Janus™ is Swiss Ranks  next generation load port which has a highly intelligent and flexible features to deliver an optimum performance to our existing and future users. It was invented to give a seamless experience to users, level up their productivity and throughput and improve their current processes.


Swiss Ranks Microwave Curing Module is a high-performance tool that combines low-temperature curing, uniformed heating and extremely fast curing time to improve throughput and efficiency in the production of semiconductor substrates.


Next Generation laser module that utilizes latest technology Laser  for a faster scribing time with increased precision, and accuracy.


Swiss Ranks Adhesive less (Electrostatic) bonding module is an adhesive-free and stand-alone charging station that provides secured and easy handling as well as the processing of thin and ultra-thin epoxy/silicon substrates up to (50 um wafer size) over a number of days or weeks depending on the substrate.


Eliminates the usage of bulky mainframes. Equipped with a linear transfer mechanism to enable faster and more accurate transfer of wafer from one process to another.


ULVTM eliminates the use of a bulky mainframes. It has a linear transfer mechanism solution under low to high vacuum conditions with an even greater level of precision and a more efficient way of wafer loading and unloading.

YS Series™

Swiss Ranks End effectors are designed for the handling of substrates- wafer and panels in specific applications according to customer requirements.


Automated Wafer Bonder/Sorter is a stand-alone bridging platform module designed for use in the semiconductor manufacturing environment.