YS Series

YS SERIES – PF009
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YS Series

Swiss Ranks End effectors are designed for the handling of substrates- wafer and panels in specific applications according to customer requirements. It is also designed to minimize and prevent particle generation, arcing, and other wafer defects.

End Effectors for Every Wafer Condition
  • Can handle all sizes from 100mm to 450 mm wafers and panels
  • Can handle substrates from 0.05 mm to 5 mm thickness
  • Can handle warped substrate as high as 10 mm warpage
  • Compatible to cassettes with tight slot wafer spacing up to 1 mm

End effectors are also customizable based on customer specifications and requirements.​

Types of substrate end effectors
  • Edge Grip End Effectors
  • Vacuum Grip End Effectors
  • Porous Chuck End Effectors
  • Esc Grip End Effectors
  • Bernoulli End Effectors (Non-contact Type)
  • Bernoulli End Effectors (Contact Type)
  • Minimum Contact Robot Blades

Other Products...

Bifrost™

Automated Wafer Bonder/Sorter is a stand-alone bridging platform module designed for use in the semiconductor manufacturing environment.

Athena™

Swiss Ranks Void’s free Chamber is a next-generation chamber that provides a smart solution in eliminating voids and gas bubbles during dispensing.

Janus™

Janus™ is Swiss Ranks  next generation load port which has a highly intelligent and flexible features to deliver an optimum performance to our existing and future users. It was invented to give a seamless experience to users, level up their productivity and throughput and improve their current processes.