Sagitta

LM-PR007

KERF LESS LASER MODULE

Next Generation Laser Module that utilizes latest technology Laser for a faster scribing time with increased precision, and accuracy. This next-gen laser module can form extremely uniform periodic structures in nano- and microscale with a minimum amount of deficiencies in substrates.

Femtosecond Laser

Eliminate the material by using a femtosecond laser without heating the substrate.

Precise and Accurate Scribing

Précised and accurate scribing of 1 μm kerf rate without sacrificing speed.

Closed-Loop Feedback System

Ensures the quality of each scribe on the wafer.

Footprint Reduction

44% less footprint occupied when compared to conventional laser modules.

Easy Integration

Enables the customer to easily integrate Swiss Ranks New Laser Module to their current system.

Product Gallery

Other Products...

Apollo™

Swiss Ranks Microwave Curing Module is a high-performance tool that combines low-temperature curing, uniformed heating and extremely fast curing time to improve throughput and efficiency in the production of semiconductor substrates.

Antlia™

ULVTM eliminates the use of a bulky mainframes. It has a linear transfer mechanism solution under low to high vacuum conditions with an even greater level of precision and a more efficient way of wafer loading and unloading.

Prometheus™

Swiss Ranks Adhesive less (Electrostatic) bonding module is an adhesive-free and stand-alone charging station that provides secured and easy handling as well as the processing of thin and ultra-thin epoxy/silicon substrates up to (50 um wafer size) over a number of days or weeks depending on the substrate.