Microwave Curing Solution

Swiss Ranks Microwave Curing Module is a high-performance tool that combines low-temperature curing, uniformed heating and extremely fast curing time to improve throughput and efficiency in the production of semiconductor substrates. Compared to other curing methods, Swiss Ranks Microwave Curing Module is advantageous in numerous ways as it produces the least amount of wafer warpage (<0.5 mm) due to the lower curing temperature, successfully performs uniform heat distribution and rapid speed curing time of only 7 minutes compared to conventional curing time of 2 hours.

  • Low Curing Temperature 30% less than TG
  • Applicable for Underfill, EMC, and Polymer
  • Controlled curing rate

Available in various modules:

  • On-site Customer Process Evaluation Single Chamber – 1 Load Port
  • Low Volume Manufacturing 1 Tool – 3 Chambers – 2 Load Ports
  • High Volume (Throughput) Module Example: 3 Tool – 9 Chambers – 6 Load Ports
Product Gallery

Other Products...


Next Generation laser module that utilizes latest technology Laser  for a faster scribing time with increased precision, and accuracy.


Janus™ is Swiss Ranks  next generation load port which has a highly intelligent and flexible features to deliver an optimum performance to our existing and future users. It was invented to give a seamless experience to users, level up their productivity and throughput and improve their current processes.


Eliminates the usage of bulky mainframes. Equipped with a linear transfer mechanism to enable faster and more accurate transfer of wafer from one process to another.