Our Products

Commercial Products

Unlocking the road to augmented intelligence


Swiss Ranks Void’s free Chamber is a next-generation chamber that provides a smart solution in eliminating voids and gas bubbles during dispensing.


Automated Wafer Bonder/Sorter is a stand-alone bridging platform module designed for use in the semiconductor manufacturing environment.

YS Series™

Swiss Ranks End effectors are designed for the handling of substrates- wafer and panels in specific applications according to customer requirements.


ULVTM eliminates the use of a bulky mainframes. It has a linear transfer mechanism solution under low to high vacuum conditions with an even greater level of precision and a more efficient way of wafer loading and unloading.


Eliminates the usage of bulky mainframes. Equipped with a linear transfer mechanism to enable faster and more accurate transfer of wafer from one process to another.


Swiss Ranks Adhesive less (Electrostatic) bonding module is an adhesive-free and stand-alone charging station that provides secured and easy handling as well as the processing of thin and ultra-thin epoxy/silicon substrates up to (50 um wafer size) over a number of days or weeks depending on the substrate.